March 25th, 2018 — Nautech and Kyocera seminar «High-performance organic package design» to be held on the 16th of April at Nautech Moscow office. The seminar addresses the challenges of today?s design and production of high-performance SiP organic packages, elaborates on how the fine design rules and high-reliability solutions of Kyocera can help to answer demands for performance, size, cost, and manufacturability. Kyocera engineers will tell about the latest trends in high-performance and high-density packaging, will introduce the best practices and guidelines for package selection, high-density routing design and assembly. The attendees will learn how to control thermal and electrical performance and optimize costs during substrate manufacturing and assembly.
Headquartered in Kyoto, Japan, Kyocera Corporation is one of the world’s leading manufacturers of fine ceramic components for the technology industry and solution provider for organic packages and printed wiring boards. In recent years, there has been a strong trend in PCB development toward high-frequency signals at low voltage. This has the advantage of ultra-fast processing of big data volumes and Kyocera offers solutions for optimizing the entire system, starting in the PCB design phase. Kyocera’s product range includes a diverse spectrum of components and parts for electronic devices such as mobile phones. It also includes items for industrial applications, such as telecommunications network equipment, high-end servers and supercomputer. In addition, the company has vast experience in the automotive industry in applications such as anti-collision systems. Kyocera aims to use its design expertise to fuel the integration of new technologies that satisfy the demands of the market.
Seminar is organized by Nautech and Kyocera.
Date: 16th of April, 2018, 10:00-18:00
Venue: Nautech office, Moscow, 2-ya Zvenigorodskaya ul., 13, bld. 43, room 403