November 19th, 2019 – UltraSoC announced new technology within its embedded monitoring and analytics infrastructure that allows designers of high-performance computing, storage and real-time devices to…
November 19th, 2019 – Cadence Design Systems announced the launch of its new Cadence® Cloud Passport Partner Program to give customers a proven and easier path…
November 4th, 2019 – Cadence Design Systems announced the Cadence® Spectre® X Simulator, a massively parallel circuit simulator designed to provide up to 10X performance gains,…
November 2nd, 2019 – Arasan Chip Systems announced the availability its MIPI CSI-2 v2.1 Tx and Rx IP Cores seamlessly integrated with its MIPI C-PHY v.1.2…
October 4th, 2019 – Cadence Design Systems, Inc. announced the third-generation Cadence® JasperGold® Formal Verification Platform, featuring machine learning technology and core formal technology enhancements. The…
September 30th, 2019 – ASE Technology Holding Co., Ltd., the leading provider of semiconductor packaging, test and system assembly services, announced that it has been included…
September 20th, 2019 – TSMC announced the expansion of the Open Innovation Platform ® (OIP) Cloud Alliance, with Mentor joining inaugural members Amazon Web Services, Cadence,…
September 13th, 2019 – Cadence Design Systems, Inc. announced that it has collaborated with TSMC to enable customers’ production delivery of next-generation system-on-chip (SoC) designs for…
September 9th, 2019 – Imagination Technologies announced that it has joined SiFive’s DesignShare ecosystem, giving system designers easy access to its industry-leading PowerVR GPU and neural…
August 29th, 2019 – Cadence Design Systems, Inc. announced TSMC certified Cadence’s design solutions for the new TSMC System-on-Integrated-Chips (TSMC-SoIC™) 3D advanced chip stacking technology, which…