September 30th, 2019 – ASE Technology Holding Co., Ltd., the leading provider of semiconductor packaging, test and system assembly services, announced that it has been included…
September 20th, 2019 – TSMC announced the expansion of the Open Innovation Platform ® (OIP) Cloud Alliance, with Mentor joining inaugural members Amazon Web Services, Cadence,…
September 13th, 2019 – Cadence Design Systems, Inc. announced that it has collaborated with TSMC to enable customers’ production delivery of next-generation system-on-chip (SoC) designs for…
September 9th, 2019 – Imagination Technologies announced that it has joined SiFive’s DesignShare ecosystem, giving system designers easy access to its industry-leading PowerVR GPU and neural…
August 29th, 2019 – Cadence Design Systems, Inc. announced TSMC certified Cadence’s design solutions for the new TSMC System-on-Integrated-Chips (TSMC-SoIC™) 3D advanced chip stacking technology, which…
August 27th, 2019 – Cadence Design Systems, Inc. announced that the Cadence® LPDDR4/4X memory IP subsystem, utilizing TSMC’s 16nm FinFET Compact (16FFC) technology, has achieved ISO…
August 22nd, 2019 – Rambus Inc. announced its newest portfolio solution of 112G Long Reach (LR) SerDes PHY on a leading-edge 7nm process node for next-generation…
August 4th, 2019 – Semiconductor intellectual property (IP) provider CAST, Inc. announced two extensions to its line of UDP/IP cores for lean Internet Protocol networking: an…
July 30th, 2019 – With TSMC providing a wider array of technologies than ever, we are expanding our design enablement solutions to match. The very latest…
July 8th, 2018 – Imagination Technologies, a leading technology provider for graphics, neural network acceleration and connectivity, announced new and enhanced tools to help developers optimise…